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Vital 93's QMC Modules and Carrier Boards Are Now On the Market

Vendor Acromag provides initial VITA 93 Quick Mezzanine Card (QMC) modules and accompanying boards to developers.

New stock in: VITA 93 QMC modules and carrier boards, ready for purchase
New stock in: VITA 93 QMC modules and carrier boards, ready for purchase

Vital 93's QMC Modules and Carrier Boards Are Now On the Market

The VITA 93 QMC standard is a groundbreaking rugged mezzanine card standard designed to provide a compact, high-density, high-speed modular solution suitable for challenging environments. This standard is particularly beneficial for applications in unmanned vehicles and narrow payload tubes, where space, weight, ruggedness, and high-speed I/O density are critical.

Significance for Unmanned Vehicles and Narrow Payload Tubes

The VITA 93 QMC modules boast a small form factor: 26 mm x 78.25 mm, significantly smaller than traditional PMC/XMC modules. This makes them well-suited to fit inside narrow payload tubes or compact spaces in unmanned vehicles where space and weight are heavily constrained.

The rugged design includes a robust connector system, the Samtec AcceleRate HD Ultra-Dense, Slim Body Arrays with a 0.635-mm pitch, that supports advanced mechanical and environmental durability needed in harsh and mobile environments. Furthermore, the standard supports high-speed serial interfaces like PCI Express Gen 6 and Compute Express Link (CXL) for demanding data throughput requirements of modern unmanned vehicle sensors and processors, enabling real-time, high-bandwidth data exchange in deployed systems.

Technical Capabilities Relevant to Rugged Modular Design

Two 80-pin sockets per QMC module are provided: one for the host interface (including power at 3.3 V and 12 V, I2C for IPMI-based intelligent platform management) and one dedicated to I/O with 40 high-density I/O signals per socket, facilitating flexible signal routing for sensors, controls, and communications.

The modular design enables system integrators to add multiple small-function QMC cards on a carrier board, allowing an extensible design that can evolve as mission needs change without increasing payload size substantially. Additionally, the standard supports both air-cooled and conduction-cooled mounting options, enhancing versatility in different vehicle and enclosure environments.

Compatible Form Factors

The VITA 93 QMC is a small form factor mezzanine module, dimensioned at 26 mm x 78.25 mm with a 4.7 mm component height, designed primarily to be mounted on carrier cards that comply with the VITA 93 standard. These carriers can host multiple QMC slots, providing a flexible platform that scales functionality through modular additions.

Industry Adoption and Relevance

VITA 93 QMC is backed by VITA and supported by a number of vendors. Acromag and other vendors are already launching QMC I/O modules targeting robust analog, digital, and serial communication functions, underscoring the standard’s industry adoption and relevance. Acromag has released new VITA 93 QMC small-form-factor mezzanine cards, including the QMC350, QMC440, QMC450, QMC510, QMC520, and QMC730, which fit in a Single QMC slot. They have also released a half-length PCI Express (PCIe) carrier card with a single QMC slot and double, triple, and quad layouts designed to handle a mix of mezzanine modules.

In conclusion, the VITA 93 QMC standard represents a modern, scalable, and rugged modular approach optimized for applications such as unmanned vehicles and compact platforms. Its compact size, rugged design, and high-speed I/O density make it an ideal choice for space-constrained, challenging environments.

The VITA 93 QMC standard, with its small form factor and rugged design, is particularly beneficial in space-constrained, challenging environments like unmanned vehicles and narrow payload tubes, thanks to its compatibility with advanced technology like data-and-cloud-computing that supports high-speed serial interfaces and real-time, high-bandwidth data exchange.

Furthermore, the standard's technology-driven capabilities, such as the support for industry-standard form factors and modular design, enable flexibility in system integration for various rugged applications in the data-and-cloud-computing sector.

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