Unveiling the VITA 93 Quantum Microcomputer
The VITA 93 QMC (Quad Mezzanine Card) standard, a new rugged mezzanine card format designed for industrial and rugged applications, is set to extend beyond traditional military and avionics use. This innovative standard, which is nearing completion, is poised to revolutionize high-speed data transfer in confined spaces within the realm of rugged and industrial computing environments.
Companies like Samtec, Elma Electronics, and TEWS Technologies are at the forefront of its development. Samtec, a renowned name in the industry, is utilising its AcceleRate HD Ultra-Dense Slim Body Arrays with a 0.635-mm pitch connector, rated up to 64 Gb/s PAM4 signaling capability, in the VITA 93 QMC. This cutting-edge connector technology ensures efficient and reliable data transmission.
Elma Electronics and TEWS Technologies are also actively involved in the development of this standard. Mark Littlefield, Senior Manager of Embedded Computing at Elma Electronics, and Jan Zimmerman, General Manager at TEWS Technologies, have both participated in a webinar discussing the features and functionality of VITA 93 QMC.
The VITA 93 QMC boasts a small form factor with two 80-pin sockets. One side connects to the host, providing power and management interfaces, while the other side is dedicated to I/O. It supports high-speed serial interfaces such as PCI Express Gen 6 and Compute Express Link (CXL). The host side supplies 3.3 V and 12 V power, an I2C interface supporting Intelligent Platform Management Interface (IPMI), and a x4 PCI Express interface along with additional signals like JTAG.
The I/O side offers five I/O pipes, each with either eight single-ended or four differential signals, with a ground pin per signal, totalling up to 40 I/O signals per single QMC socket. This dense connector design ensures maximum utilisation of space while maintaining high-speed data transfer capabilities.
Moreover, compatibility with upcoming VITA 100.20 module management standards is planned, further enhancing its versatility. The VITA 93 QMC's robust design and advanced signaling make it suitable for rugged or industrial computing environments.
Applications targeted by VITA 93 QMC include rugged and industrial embedded systems requiring high-speed data transfer in confined spaces. The standard and its supporting modules/carrier cards are currently being introduced by companies like Acromag, which announced the first QMC I/O modules and carrier cards in mid-2025, demonstrating industry adoption for high-performance embedded computing.
For those interested in learning more about the VITA 93 QMC standard, a webinar hosted under the TechXchange section provides an in-depth look at its features, form factors, and more. This standard, with its potential to transform industrial computing, is undoubtedly a mezzanine standard for all.
Data-and-cloud-computing technologies are poised to leverage the VITA 93 QMC standard, as it revolutionizes high-speed data transfer in rugged and industrial computing environments. Companies like Samtec, Elma Electronics, and TEWS Technologies, at the forefront of the standard's development, are integrating advanced connector technologies, ensuring efficient and reliable data transmission.
