Polymatech Opens New $116M PCB Facility in Estonia
Polymatech Electronics has inaugurated a new PCB manufacturing facility in Estonia, marking a significant addition to its global footprint. The company invested around $116 million in the project, which features a state-of-the-art 929sqm cleanroom and advanced machinery.
CEO Eswara Rao Nandam expressed confidence that the new facility will cater to the growing demand in high-end applications. Dr. Allen Nejah, chief innovation officer, hailed the new site as 'a remarkable achievement'.
Spanning 929sqm, the cleanroom houses advanced machinery, enabling the production of up to 50,000sqm of multi-layer high-density interconnect (HDI) PCBs annually. The facility will serve premium mobile phone manufacturers and industries such as defence, aerospace, and semiconductors. This expansion follows Polymatech's investments in France and Bahrain earlier this year.
The new Estonian facility bolsters Polymatech's global presence, demonstrating the company's commitment to meeting the increasing demand for high-end PCB solutions. With its advanced capabilities, the new site is poised to make a substantial impact on the industry.
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