Domestic semiconductor manufacturer SMIC trials initial homemade immersion deep UV lithography tool, moving closer to self-reliance in wafer fabrication equipment production.
Shanghai Yuliangsheng Technology Co., a Chinese company, has made headlines as it finds itself on the U.S. Department of Commerce's Entity List, announced in late 2024. Amidst this, the company is pushing forward with its efforts to develop a domestic lithography tool, codenamed 'Mount Everest'.
This tool, designed for potential use in 7nm or 5nm production nodes, is currently being tested by the largest foundry in China, Semiconductor Manufacturing International Corporation (SMIC). It is unclear whether SMIC is using the Yuliangsheng tool in its production flow or if the company is only testing the scanner.
The Yuliangsheng tool shares some resemblance to ASML's Twinscan NXT:1950i, a lithography machine designed for 32nm-class process technology in one exposure, but the NXT:2000i developed by ASML for 7nm and 5nm-class nodes is generations ahead.
The development of the 'Mount Everest' tool is expected to take years to jump to 16nm, and then to 7nm fabrication nodes with a significantly redesigned scanner. Once the supply chain is localized, China could potentially operate outside the influence of U.S. or European export policies in this segment of chip production.
SMIC, on the other hand, plans to integrate domestic immersion DUV lithography machines into production lines starting in 2027, after their qualification. This move is significant as it could reduce China's reliance on foreign technology and advance its domestic semiconductor industry.
Interestingly, another entity, SiCarrier, is reportedly an investor of Yuliangsheng and likely belongs to the same group working on the same goal. Both SiCarrier and Shanghai Yuliangsheng Technology Co. tend to name their WFE projects after mountains.
The Yuliangsheng lithography machine, currently tested by SMIC, is still in the testing phase with no confirmed integration into the production line yet. If the scanner is only being tested, it is likely several years away from mass-producing actual chips.
It's worth noting that the expected timeline for sub-10nm fabrication processes on domestic lithography systems is not before 2030. This highlights the challenge faced by Shanghai Yuliangsheng Technology Co. in catching up with industry leaders in terms of technology advancement.
The tool is primarily made from components sourced within China, but some parts are still imported. The company is working to localize the entire supply chain for the tool, a crucial step towards self-sufficiency in the semiconductor industry.
As the race for technological advancement in the semiconductor industry continues, the development and integration of the Yuliangsheng tool could play a significant role in China's quest for chip independence.
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