Auto Industry Update: Collaboration Announced Between Cadence, Samsung, Vic One, SolidRun, and Murata in the Realm of Connected Cars
In the ever-evolving world of technology, collaborations between leading companies are pushing boundaries and driving advancements in various sectors. Here's a roundup of some significant partnerships that are shaping the future of AI, automotive, and RF technologies.
Cadence, a leading electronic design automation company, has extended its collaboration with Samsung Foundry, a leading semiconductor manufacturer, with a multi-year agreement. This partnership is focusing on AI, automotive, and 3D-IC applications through new multi-year intellectual property (IP) agreements and joint development efforts.
Key aspects of this partnership include an expanded IP portfolio for Samsung's advanced process nodes, such as SF4X, SF5A, and SF2P. This includes advanced memory technologies like LPDDR6/5x-14.4G, GDDR7-36G, DDR5-9600, as well as interface IP including PCIe 6.0/5.0, CXL 3.2, UCIe-SP 32G and 10G multi-protocol PHY, USB, DP-TX, PCIe 3.0, and SGMII. Tailored IP such as LPDDR5X-8533 PHY specifically supports automotive applications, and advanced PHY solutions support chiplet architectures.
The collaboration also leverages Cadence’s AI-based digital design tools integrated with Samsung’s semiconductor manufacturing technologies. This synergy allows the companies to develop high-performance, low-power solutions optimized for AI data centers, advanced driver-assistance systems (ADAS) in automotive, next-generation RF connectivity, and 3D-IC designs.
Cadence and Samsung Foundry have also achieved certification of Cadence's full digital flow on the SF2P node, enabling faster time to market for advanced SoCs and 3D-ICs. They have also successfully automated the migration of analog cell-based IP from 4nm to 2nm nodes, enhancing power integrity and thermal/warpage analyses for 3D-ICs via GPU acceleration.
Meanwhile, Murata Manufacturing has introduced the BLM15VM series, the world's first AEC-Q200-compliant chip ferrite beads designed to suppress wide-band noise at high frequencies up to 5.9GHz. This development is critical for C-V2X and autonomous driving applications and is scheduled for mass production in July 2025.
In another significant development, Keysight Technologies, in partnership with NTT and NTT Innovative Devices, has set a world record by achieving a 280 Gbps data rate using sub-terahertz (THz) frequencies in the 300 GHz band. This record is the highest data rate reported at this frequency and marks a major advancement for high-speed wireless communications needed for future 6G, AI, and autonomous vehicle applications.
The record was enabled by Keysight's Vector Component Analyzer (VCA) and NTT's high-output, wide-bandwidth Indium Phosphide (InP)-based J-band power amplifier, alongside digital predistortion (DPD) techniques.
SolidRun, a developer of embedded computing platforms, has partnered with Germany's CiT - Communication in Traffic (by consider it GmbH) to enhance Vehicle-to-Everything (V2X) communication. The CiT One devices support real-time data processing, secure wireless communication (DSRC/802.11p), and multi-interface connectivity for applications like smart transit, emergency vehicle prioritization, and autonomous driving.
The American Center for Mobility (ACM) has partnered with cybersecurity firms VicOne and Block Harbor to strengthen electric vehicle charging infrastructure against cyber threats. The partnership will offer services including free vulnerability assessments for qualified companies.
These collaborations underscore the importance of partnerships in driving innovation and pushing the boundaries of what is possible in AI, automotive, and RF technologies. As these sectors continue to evolve, we can expect to see more groundbreaking developments in the near future.
[1] https://www.cadence.com/news/cadence-samsung-foundry-partnership [2] https://www.samsung.com/global/business/foundry/news/samsung-foundry-and-cadence-announce-expanded-collaboration-for-next-generation-rf-applications/ [3] https://www.semiconductorengineering.com/news/2022/05/cadence-samsung-foundry-announce-expanded-collaboration-for-next-generation-rf-applications
Technology collaborations, such as the one between Cadence and Samsung Foundry, are proving essential in the advancement of AI, automotive, and RF technologies. By extending their multi-year agreement, these companies are focusing on new multi-year intellectual property (IP) agreements and joint development efforts in these sectors, including expanded IP portfolios for advanced process nodes and tailored IP for automotive applications.
